Two component epoxy resin system
Master Bond is a thermally conductive, low viscosity epoxy with cryogenic serviceability.
Hackensack, N.J., August 16, 2010—Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.
EP30FLAO features a wide service temperature range of 4K to 250F. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75F. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.
Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.