Two component epoxy resin system

Master Bond is a thermally conductive, low viscosity epoxy with cryogenic serviceability.

Hackensack, N.J., August 16, 2010—Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a wide service temperature range of 4K to 250F. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75F. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

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